Clamp-type HP device
"Even warped substrates can be uniformly heated" By adopting a clamp structure, it is possible to uniformly heat while suppressing warping of the substrate!
When heating the substrate in processes such as FOPLP and FCBGA, we are troubled by the issue of "warping during heating." The device that solves this "warping during heating" is the "Clamp-type HP device." 【Features】 ■ Adjustable clamping time, force, and timing ■ Plate temperature: ±1℃ *For details, please request materials or view the PDF data from the download.
- Company：クリーン・テクノロジー
- Price：Other
